Cadence Unveils Agent-Based AI 'OraStack' for PCB Design Support

Cadence Design Systems has launched OraStack, an agent-based AI system supporting PCB design and testing for electrical engineers. According to The Register, OraStack enhances PCB and advanced packaging design/test workflows through high-precision simulations, while Cadence clarifies it does not replace existing tools with hallucinating models. The platform integrates with various open and proprietary models, utilizing natural language interfaces to coordinate Cadence's existing test and simulation suites. Michael Jackson, Cadence' senior vice president of system design analysis, stated, 'AI is elevating engineering products and technological value.' OraStack enables complex multi-stage circuit design/test workflows across CPUs, GPUs, and other accelerators. Cadence has also developed similar agents for digital/analog chip design.