Samsung Electronics and Broadcom Ink 2000-Billion-Dollar Semiconductor Foundry and Memory Collaboration

Samsung Electronics is advancing a 2000-billion-dollar semiconductor collaboration with Broadcom, covering AI memory solutions including high-bandwidth memory (HBM), foundry services, and advanced packaging. The partnership, announced at the AI Summit in San Francisco, aims to build next-generation AI infrastructure through a strategic MOU. Samsung will provide cutting-edge memory solutions to enhance Broadcom's AI accelerators, while applying 2nm process technology to Broadcom's high-speed data communication products. The collaboration spans semiconductor design, packaging, and manufacturing to shorten development cycles and optimize performance. This partnership is positioned to strengthen the semiconductor ecosystem's competitiveness in the rapidly growing AI and high-performance computing markets.