Samsung Electronics to Supply 2nm Foundry and HBM to Broadcom

Samsung Electronics has entered a strategic partnership with Broadcom to collaborate on next-generation AI infrastructure. The companies announced the agreement at the AI Summit in San Francisco, pledging to invest over $20 billion over five years in memory and foundry technologies. The partnership spans memory, foundry, and advanced packaging, offering a 'one-stop turnkey solution' that integrates these capabilities. Samsung will support Broadcom's AI accelerators through its memory and manufacturing expertise, including supplying high-performance HBM memory and 2nm foundry processes. The collaboration aims to streamline chip design and production, shorten development cycles, and capture opportunities in the AI and high-performance computing markets.